Thinking Thin Brings New Layering and Thermal Abilities to the Semiconductor Industry
Tuesday, July 11, 2017 - 11:02
in Physics & Chemistry
The concept of a simple technique to remove thin layers from otherwise thick, rigid semiconductor crystals has been actively explored for years. In a significant advance, a research group from IBM successfully applied their new "controlled spalling" layer transfer technique to gallium nitride (GaN) crystals, a prevalent semiconductor material, and created a pathway for producing many layers from a single substrate. They report their work in this week's Journal of Applied Physics.