Thinking thin brings new layering and thermal abilities to the semiconductor industry
Tuesday, July 11, 2017 - 14:32
in Physics & Chemistry
The concept of a simple technique to remove thin layers from otherwise thick, rigid semiconductor crystals has been actively explored for years. In a significant advance, a research group has successfully applied their new 'controlled spalling' layer transfer technique to gallium nitride (GaN) crystals, a prevalent semiconductor material, and created a pathway for producing many layers from a single substrate.