Modelling wrinkling and buckling in materials that form the basis of flexible electronics
Tuesday, April 21, 2020 - 09:30
in Physics & Chemistry
Flexible circuits have become a highly desirable commodity in modern technology, with applications in biotechnology, electronics, monitors and screens, being of particular importance. A new paper authored by John F. Niven, Department of Physics & Astronomy, McMaster University, Hamilton, Ontario, published in EPJ E, aims to understand how materials used in flexible electronics behave under stress and strain, particularly, how they wrinkle and buckle.