Thin cooling device for compact electronics
Fujitsu Laboratories today announced the development of the world's first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localized parts in devices has become problematic. Fujitsu has developed a thin loop heat pipe, less than one millimeter thick, to solve this problem. This new device was developed using technologies for stacking metal sheets. It is capable of transferring approximately five times more heat than current thin heat pipes. This technology will make it possible for CPUs and other heat-generating components to run cooler and to avoid concentrated hot-spots inside devices.