ICECool to crack thermal management barrier, enable breakthrough electronics
Friday, June 8, 2012 - 07:31
in Physics & Chemistry
The continued miniaturization and the increased density of components in todays electronics have pushed heat generation and power dissipation to unprecedented levels. Current thermal management solutions, usually involving remote cooling, are unable to limit the temperature rise of todays complex electronic components. Such remote cooling solutions, where heat must be conducted away from components before rejection to the air, add considerable weight and volume to electronic systems. The result is complex military systems that continue to grow in size and weight due to the inefficiencies of existing thermal management hardware.