CNSE develops innovative laser-enabled electronic packaging technology

(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging (LEAP), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.

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