Elpida begins sample shipments of DDR3 SDRAM (x32) based on TSV stacking technology
Tuesday, June 28, 2011 - 12:50
in Physics & Chemistry
Elpida Memory today announced that it has begun sample shipments of the industry's first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) stacking technology. The sample is a low-power 8-gigabit (1-gigabyte) DDR3 SDRAM assembled in a single package that consists of four 2-gigabit DDR3 SDRAMs fitted to a single interface chip using TSV.