Researchers advance design-dependent process monitoring for semiconductor wafer manufacturing
Wednesday, May 25, 2011 - 10:00
in Physics & Chemistry
Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, and researchers from the UCLA Henry Samueli School of Engineering and Applied Science have developed a new method of design-dependent process monitoring for semiconductor wafer manufacturing. The advance promises to provide semiconductor chip manufacturing cost and productivity savings up to 15 percent, potentially increase profit per chip by as much as 12 percent and ultimately lead to less expensive and higher performing electronics devices.