Silver-diamond composite offers cooling capabilities for electronics

Tuesday, March 1, 2011 - 08:01 in Physics & Chemistry

(PhysOrg.com) -- Researchers at the Georgia Tech Research Institute (GTRI) are developing a solid composite material to help cool small, powerful microelectronics used in defense systems. The material, composed of silver and diamond, promises an exceptional degree of thermal conductivity compared to materials currently used for this application.

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