Technique allows researchers to examine how materials bond at the atomic level
Thursday, October 7, 2010 - 15:30
in Physics & Chemistry
(PhysOrg.com) -- An approach pioneered by researchers at North Carolina State University gives scientists new insight into the way silicon bonds with other materials at the atomic level. This technique could lead to improved understanding of and control over bond formation at the atomic level, and opportunities for the creation of new devices and more efficient microchips.