SEMATECH Achieves Submicron 3D IC Bond Alignment Results in Integrated Bonding Tool Platform
Thursday, June 10, 2010 - 15:23
in Physics & Chemistry
Researchers from SEMATECH's 3D Interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through a series of tool and process hardening improvements.