Samsung's New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications
Tuesday, May 4, 2010 - 15:30
in Physics & Chemistry
Samsung Electronics today introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications. Samsung's new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.