Developing LSI for High Speed Next Generation Communication Interfaces
Friday, February 19, 2010 - 12:14
in Physics & Chemistry
NEC Corp. announced today the development and successful demonstration of LSI technology for next-generation high-speed serial communication interfaces. This new technology allows inter-chip communication that is three times faster than modern communication interface standards, such as USB 3.0 and PCI Express 2.0, without using complicated transmission modes like multilevel transmission.