3-D Chip Design Challenges
Friday, February 19, 2010 - 14:35
in Mathematics & Economics
(PhysOrg.com) -- With the increase functionality of electronic gadgets, the need to pack more transistors into a single package is becoming a needed necessity. There`s a big demand, in the consumer market, for smaller packages and in order to meet this demand, 3-D chip technology must be perfected.