Low Temperature Laser Processing Solves a Problem in Smart Materials Manufacturing
Thursday, December 18, 2008 - 15:56
in Physics & Chemistry
(PhysOrg.com) -- If researchers could integrate some of the active materials, such as perovskites, that have been developed in recent years for microsensor, actuator, and transducer applications directly onto a flexible polymer substrate or a CMOS integrated circuit, it would provide them with the ability to make new devices or shrink current electronics into smaller packages.
Read the whole article on Physorg
More from Physorg
Related
- UB engineers prove that carbon nanotubes are superior to metals for electronicsFri, 20 Mar 2009, 14:44:20 EDT
- Scientists demonstrate method for integrating nanowire devices directly onto siliconThu, 8 May 2008, 16:56:30 EDT
- A first in integrated nanowire sensor circuitryMon, 4 Aug 2008, 17:43:08 EDT
- Princeton researchers discover new type of laserMon, 22 Dec 2008, 12:37:25 EST
- Graphene may have advantages over copper for IC interconnects at the nanoscaleThu, 4 Jun 2009, 12:51:07 EDT