Tough Electronics Based on Bullet-Proof Kevlar
Friday, October 31, 2014 - 08:30
in Physics & Chemistry
A group of North Carolina State University researchers is exploring novel ways to apply semiconductor industry processes to unique substrates to "weave together" multifunctional materials with distinct capabilities. During the AVS 61st International Symposium & Exhibition, they will describe how they were able to "weave" high-strength, highly conductive yarns made of tungsten on Kevlar -- aka body armor material -- by using atomic layer deposition, a process commonly used for producing memory and logic devices.