Cracking a Tough Nut for the Semiconductor Industry

Wednesday, December 24, 2008 - 10:28 in Physics & Chemistry

Researchers at the National Institute of Standards and Technology (NIST) have developed a method to measure the toughness--the resistance to fracture--of the thin insulating films that play a critical role in high-performance integrated circuits.

Read the whole article on Newswise - Scinews

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