New heat model may help electronic devices last longer
Monday, December 16, 2019 - 10:50
in Physics & Chemistry
A University of Illinois-based team of engineers has found that the model currently used to predict heat loss in a common semiconductor material does not apply in all situations. By testing the thermal properties of gallium nitride semiconductors fabricated using four popular methods, the team discovered that some techniques produce materials that perform better than others. This new understanding can help chip manufacturers find ways to better diffuse the heat that leads to device damage and decreased device lifespans.