Self-assembled monomolecular organic films to seal ultra-porous low-k materials
Wednesday, July 15, 2015 - 06:00
in Physics & Chemistry
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of an organic monolayer, paves the way to scaling interconnects beyond N5.