NXP pushes car-to-X market with launch of new RoadLINK solution
Thursday, June 12, 2014 - 05:32
in Physics & Chemistry
NXP Semiconductors today announced that the TEF510x, the second product from the RoadLINK range, is now available to automotive Original Equipment Manufacturers (OEMs) and Tier 1 suppliers for design-in. The TEF510x is a dual radio multi band RF transceiver for Car-to-X (C2X) applications. Supporting global C2X and Wi-Fi standards, the TEF510x provides OEMs with an optimized solution to meet 802.11p modem functionality on one chip. The chip has the flexibility to support global deployments and various system configurations.