Microtechnology: Double-layer capping solves two problems
Wednesday, January 15, 2014 - 09:01
in Physics & Chemistry
Continual downsizing of technology means that researchers have to develop ever more ingenious methods of packaging and protecting their tiny devices. Jae-Wung Lee and co-workers at the A*STAR Institute of Microelectronics, Singapore, are at the forefront of efforts to develop safe but functional encasements for microelectromechanical systems (MEMS), such as sensors, switches or radio filters.