Researchers utilize atomic layer etch analysis to accelerate development of green chemistries
Thursday, March 21, 2013 - 14:00
in Physics & Chemistry
Researchers sponsored by Semiconductor Research Corporation (SRC) today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach under way at the University of California, Los Angeles (UCLA) will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.