220-300C low-melting glass for hermetic sealing: Gold-tin solder level temperatures achieved
Tuesday, November 27, 2012 - 07:30
in Physics & Chemistry
Hitachi today announced the successful development of a 220-300C low-melting temperature glass ("low-melting glass"). This glass was developed as a low temperature sealant which does not contain regulated materials such as lead which presents a high environmental load or easily vaporized halogens such as fluorine or iodine.