New LED packaging technology improves performance
Tuesday, September 25, 2012 - 07:50
in Physics & Chemistry
(Phys.org)—Many researchers have reported improvements in LED technology by enhancing the properties of the LED itself. But the packaging that secures and protects the LED also impacts its overall performance. In a new study, researchers from Taiwan have designed a "flip glass substrate" for packaging LEDs, and demonstrated improvements in terms of a wider viewing angle, better color uniformity, and earlier identification of flaws during production compared with other LED packaging methods.