IBM to produce Micron's hybrid memory cube in debut of first commercial, 3D chip-making capability
Monday, December 5, 2011 - 09:31
in Physics & Chemistry
IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.