NDSU Develops Innovative Laser-Enabled Electronic Packaging Technology
Friday, October 21, 2011 - 15:31
in Physics & Chemistry
A new electronics manufacturing technology developed at North Dakota State University, Fargo, eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging (LEAP(tm)), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.