Slimmer, Stickier Nanorods Give Boost To 3-D Computer Chips
Monday, March 23, 2009 - 22:28
in Physics & Chemistry
Researchers have developed a new technique for growing slimmer copper nanorods, a key step for advancing integrated 3-D chip technology. These thinner copper nanorods fuse together, or anneal, at about 300 degrees Celsius. This relatively low annealing temperature could make the nanorods ideal for use in heat-sensitive nanoelectronics, particularly for "gluing" together the stacked components of 3-D computer chips.