Test Technique Helps Improve Electronics Reliability

Thursday, April 12, 2012 - 08:30 in Physics & Chemistry

Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in microelectronic devices, photovoltaic cells and microelectromechanical systems (MEMS).

Read the whole article on Newswise - Scinews

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