Small wires make big connections for microelectronics
Friday, July 16, 2010 - 14:14
in Physics & Chemistry
Engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics. The technique produces tiny pure metal wires much smaller in diameter than traditional wires and requiring two orders of magnitude less bonding area. This could enable more complex integrated functions in microelectronics.