Core technology for ultra-small 3-D image sensor
Friday, February 8, 2019 - 10:10
in Physics & Chemistry
A KAIST research team developed a silicon optical phased array (OPA) chip, which can be a core component for three-dimensional image sensors. This research was co-led by Ph.D. candidate Seong-Hwan Kim and Dr. Jong-Bum You from the National Nanofab Center (NNFC).