Continuous roll-process technology for transferring and packaging flexible LSI
Monday, August 29, 2016 - 11:01
in Physics & Chemistry
A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits (LSI), the key element in constructing the computer's brain such as CPU, on plastics to realize flexible electronics.