Infineon offers application optimized bipolar power modules introducing cost-effective solder bond modules
Tuesday, November 25, 2014 - 10:02
in Physics & Chemistry
Infineon Technologies AG today launches bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the company expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. Infineon offers optimized solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions.